Advanced Interconnects: Design, Process, And Integration

Synopsis

A video recording of a short course held by the International Electron Devices Meeting (IDEM) in 2000. As technologies scale to the 0.13 ?m generation and below, interconnect performance is an increasingly large factor to consider in high-performance and low-power chip designs. To improve interconnect performance at the same pace as transistor performance, revolutionary changes in the material systems are required. However, there are significant challenges associated with the introduction of new materials into a manufacturing environment. This course describes the materials, process, manufacturing, and design trends in interconnect technology with a focus on copper and low-K interconnect systems. The first lecture covers interconnect trends and chip design issues and how they influence the selection of the interconnect architecture. The second lecture presents an overview of the materials and process issues for copper and low-K materials focusing on the evolution of the materials systems over time. The third lecture describes unique integration issues surrounding copper and low-K. The fourth lecture discusses the manufacturing issues including defect monitoring and parameter control at the sector level. Finally, interconnect reliability issues are covered, contrasting the failure modes in Aluminum to Copper.

Contents :
Program Outline: Interconnect Architecture, Copper and Low-K Materials, Interconnect Integration, Interconnect Manufacturing Issues, Interconnect Reliability

Language

English

Country

United States

Year of release

2001

Year of production

2000

Notes

On 4 videocassettes

Subjects

Information technology

Keywords

electronic engineering; materials; microelectronic devices; interconnect technology

Distribution Formats

Type

VHS

Format

PAL

Price

$450.00

Availability

Sale

Duration/Size

420 mins

Year

2003

Production Company

Name

International Electron Devices Meeting (IEDM)

Distributor

Name

Institute of Electrical and Electronic Engineers Inc

Email

customer-service@ieee.org

Web

http://www.ieee.org/organizations/eab/ceus/ssvideo.htm External site opens in new window

Phone

+1 908 562 5493

Address

445 Hoes Lane
PO Box 1331
Piscataway
NJ 08855-1331
USA